Renesas H8 Series Hardware Manual

Section 1 Overview
Rev. 7.00 Mar 10, 2005 page 18 of 652
REJ09B0042-0700
Table 1.4 Bonding Pad Coordinates of HCD64338024S, HCD64338023S, HCD64338022S,
HCD64338021S, and HCD64338020S
Coordinates Coordinates
Pad No. Pad Name X (µ
µµ
µm) Y (µ
µµ
µm) Pad No. Pad Name X (µ
µµ
µm) Y (µ
µµ
µm)
1AV
CC
–1338 1053 41 P84/SEG29 1338 –1121
2 P13/TMIG –1338 823 42 P85/SEG30 1338 –929
3 P14/ IRQ4 / ADTRG –1338 737 43 P86/SEG31 1338 –820
4 P16 –1338 649 44 P87/SEG32 1338 –721
5 P17/ IRQ3 /TMIF –1338 556 45 PA3/COM4 1338 –610
6 X1 –1338 460 46 PA2/COM3 1338 –499
7 X2 –1338 363 47 PA1/COM2 1338 –388
8V
SS
= AV
SS
–1338 229 48 PA0/COM1 1338 –277
9 OSC2 –1338 100 49 V3 1338 –189
10 OSC1 –1338 13 50 V2 1338 –91
11 TEST –1338 –74 51 V1 1338 6
12 RES –1338 –168 52 V
CC
1338 156
13 P50/ WKP0 /SEG1 –1338 –265 53 V
SS
1338 362
14 P51/ WKP1 /SEG2 –1338 –373 54 P90/PWM1 1338 528
15 P52/ WKP2 /SEG3 –1338 –481 55 P91/PWM2 1338 614
16 P53/ WKP3 /SEG4 –1338 –590 56 P92 1338 699
17 P54/ WKP4 /SEG5 –1338 –698 57 P93 1338 785
18 P55/ WKP5 /SEG6 –1338 –806 58 P94 1338 871
19 P56/ WKP6 /SEG7 –1338 –892 59 P95 1338 957
20 P57/ WKP7 /SEG8 –1338 –1091 60 IRQAEC 1338 1147
21 P60/SEG9 –1121 –1338 61 P30/UD 1131 1338
22 P61/SEG10 –927 –1338 62 P31/TMOFL 936 1338
23 P62/SEG11 –805 –1338 63 P32/TMOFH 831 1338
24 P63/SEG12 –703 –1338 64 P33 735 1338
25 P64/SEG13 –593 –1338 65 P34 631 1338
26 P65/SEG14 –483 –1338 66 P35 526 1338
27 P66/SEG15 –372 –1338 67 P36/AEVH 421 1338
28 P67/SEG16 –263 –1338 68 P37/AEVL 317 1338
29 P70/SEG17 –166 –1338 69 P40/SCK32 212 1338
30 P71/SEG18 –47 –1338 70 P41/RXD32 108 1338
31 P72/SEG19 55 –1338 71 P42/TXD32 3 1338
32 P73/SEG20 166 –1338 72 P43/ IRQ0 –101 1338
33 P74/SEG21 277 –1338 73 PB0/AN0 –249 1338
34 P75/SEG22 388 –1338 74 PB1/AN1 –362 1338
35 P76/SEG23 499 –1338 75 PB2/AN2 –476 1338
36 P77/SEG24 610 –1338 76 PB3/AN3/ IRQ1 /TMIC –589 1338
37 P80/SEG25 701 –1338 77 PB4/AN4 –702 1338
38 P81/SEG26 790 –1338 78 PB5/AN5 –791 1338
39 P82/SEG27 885 –1338 79 PB6/AN6 –880 1338
40 P83/SEG28 1076 –1338 80 PB7/AN7 –1081 1338
Note: Pad No. 11 (TEST) should be connected to V
SS
.
If it is not connected, the LSI will not operate correctly.
These values show the coordinates of the centers of pads. The accuracy is ±5 µm.
The home-point position is the chip’s center and the center is located at halfway between the upper and lower pads and
the left and right pads.

Renesas H8 Series Specifications

General

Brand	Renesas
Model	H8 Series
Category	Computer Hardware
Language	English