Renesas H8 Series - Page 59

Section 1 Overview
Rev. 7.00 Mar 10, 2005 page 17 of 652
REJ09B0042-0700
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(0.0)
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Chip size: 2.91 mm × 2.91 mm
Voltage level on the back of the chip: GND
Figure 1.7 Bonding Pad Location Diagram of HCD64338024S, HCD64338023S,
HCD64338022S, HCD64338021S, and HCD64338020S (Top View)