8. Thermal management system
8.4 Thermal sensors
The Pr ojector is equipped with a n umber of thermal sensors. This is both bimetal and thermocouple (P/N based) s ensors, in order
to have both immediate thermal shutdown (bimetal), and also as a read ing of the real time temp erature. See Thermal Manag ement
Diagram for a schema tic overview.
8.5 Engine heatsink
DMD cooling is provided by Liquid C ooling Pump 5, and a dual Peltier m odule connected t o a heatsink. The heatsink is used to
disperse the heat em itted by the illumination sy stem and prevent the DLP® chip absorbing too much heat. The heatsink is a heat
pipe construction combined with a dual P eltier module. This ensures that the DM D device ope rates within its recommended thermal
envelope, and connects it phy sically to the Heatsink. A spring loaded mechanism in the heatsink ensures adequate tension of the
Peltier s tud against the DMD device for optimal heat dissipation.
Always ren ew the thermal gasket on the stud when performin g any service operation which constitutes re-
moving the Peltier/heatsink from the DM D device.
8.6 System thermal diagram
Figures in the nominal settings and lifetime s ettings ch arts may vary due to different operation conditions, including mounting pos i-
tion, saturation of filters (if optional dust filter is installed and filter saturation sensor activates) etc.
36 723–0016 F90 01/12/2017
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