Renesas H8 Series Hardware Manual

Section 1 Overview
Rev. 7.00 Mar 10, 2005 page 15 of 652
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Type code
Chip size: 3.84 mm × 4.24 mm
Voltage level on the back of the chip: GND
: NC pad
Figure 1.6 Bonding Pad Location Diagram of HCD64F38024, HCD64F38024R (Top View)

Renesas H8 Series Specifications

General

Brand	Renesas
Model	H8 Series
Category	Computer Hardware
Language	English