Appendix H Form of Bonding Pads
Rev. 7.00 Mar 10, 2005 page 649 of 652
REJ09B0042-0700
Appendix H Form of Bonding Pads
The form of the bonding pads for the HCD64338024, HCD64338023, HCD64338022,
HCD64338021, HCD64338020, HCD64F38024, HCD64F38024R, HCD64338024S,
HCD64338023S, HCD64338022S, HCD64338021S, and HCD64338020S is shown in figure H.1.
Bonding area
Metal layer
5 mm72 mm
5 mm
72 mm
Figure H.1 Bonding Pad Form
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