v
Expander modules ··············································································································· 11-37
Diagnostic panels················································································································· 11-38
Diagnostic panel specifications ························································································· 11-38
Diagnostic panel view ····································································································· 11-38
LEDs ·························································································································· 11-38
Fiber transceiver modules ······································································································ 11-42
Storage options other than HDDs and SDDs ·············································································· 11-42
NVMe VROC modules ·········································································································· 11-42
TPM/TCM modules ·············································································································· 11-42
Compute modules ················································································································ 11-43
Security bezels, slide rail kits, and CMA ···················································································· 11-43
12 Appendix C Managed hot removal of NVMe drives ························ 12-1
Performing a managed hot removal in Windows ·········································································· 12-1
Prerequisites ················································································································· 12-1
Procedure ····················································································································· 12-1
Performing a managed hot removal in Linux ··············································································· 12-2
Prerequisites ················································································································· 12-2
Performing a managed hot removal from the CLI ·································································· 12-2
Performing a managed hot removal from the Intel
®
ASM Web interface ····································· 12-3
13 Appendix D Environment requirements ······································· 13-1
About environment requirements ······························································································ 13-1
General environment requirements ··························································································· 13-1
Operating temperature requirements ························································································· 13-1
14 Appendix E Product recycling ··················································· 14-1
15 Appendix F Glossary ······························································· 15-1
16 Appendix G Acronyms ····························································· 16-1
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