Table 1-1 (Cont.) Replaceable Components
Component
Service
Instructions
Description Service
Level
M.2 flash
SSDs
Up to two hot-pluggable internal M.2 NVMe SSDs in up to two SSD Risers. Hot
service
DIMMs Add or replace memory modules in the system. Cold
service
Battery Lithium coin-cell battery that powers CMOS BIOS and RTC real-time clock. Cold
service
PCIe cards Optional PCIe Add-in cards (AIC) that can expand server functionality.
1
Cold
service
Hot
service
PCIe Risers Two optional PCIe Risers to accommodate Full Height PCIe Cards labeled Riser 2
and Riser 6.
Cold
service
Air baffle Directs cool air towards the system components. Cold
service
Motherboard
assembly
Motherboard (MB) Provides connectors for the DIMMs, processors, PCIe risers, and
other components.
Cold
service
Processor Processor with heatsink that carries out the instructions of the system. Cold
service
Disk backplane 4 or 12 disk backplane (DBP) provides power and communications connectors for 4
NVMe SFF or 12 SAS-3 LFF storage drives.
Cold
service
Front LED
indicator
module
FIM contains the push-button circuitry and LEDs that are displayed on the front panel. Cold
service
SAS cables Provides SAS-3 signals between card located in PCIe slots and the disk backplane. Cold
service
1
Oracle Flash Accelerator F680 PCIe Card: 6.8 TB, NVMe PCIe 4.0 in Exadata Database Server X10M, Exadata Storage Server X10M,
and Exadata Control Plane Server X10M
Chapter 1
Replaceable Components
1-13
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