Electrical Characteristics
R
190 Intel
®
82925X/82925XE MCH Datasheet
Symbol
Signal
Group
Parameter Min Nom Max Unit Notes
3
C
PAD
(a, c) Host GTL+ Input
Capacitance
2 — 3.5 pF
C
PCKG
(a, c) Host GTL+ Input
Capacitance (common
clock)
0.90 — 2.5 pF
DDR2 Interface
V
IL(DC)
(DDR2) (k) DDR2 Input Low Voltage — — SMVREF (DDR2)
– 0.125
V
V
IH(DC)
(DDR2) (k) DDR2 Input High Voltage SMVREF
(DDR2)
+
0.125
— — V
V
IL(AC)
(DDR2) (k) DDR2 Input Low Voltage — — SMVREF (DDR2)
– 0.250
V
V
IH(AC)
(DDR2) (k) DDR2 Input High Voltage SMVREF
(DDR2)
+
0.250
— — V
V
OL
(DDR2)
(k, l) DDR2 Output Low
Voltage
— — 0.3 V 1
V
OH
(DDR2)
(k, l) DDR2 Output High
Voltage
1.5 — V 1
I
Leak
(DDR2)
(k) Input Leakage Current — — ±10 µA
C
I/O
(DDR2)
(k, l) DDR2 Input/Output Pin
Capacitance
3.0 — 6.0 pF
1.5 V PCI Express Interface Specification 1.0a
V
TX-DIFF P-P
(f) Differential Peak to Peak
Output Voltage
0.400 — 0.600 V 2
V
TX_CM-ACp
(f) AC Peak Common Mode
Output Voltage
— — 20 mV
Z
TX-DIFF-DC
(f) DC Differential TX
Impedance
80 100 120 Ohms
V
RX-DIFF p-p
(e) Differential Peak to Peak
Input Voltage
0.175 — 0.600 V 3
V
RX_CM-ACp
(e) AC peak Common Mode
Input Voltage
— — 150 mV
Clocks, Reset, and Miscellaneous Signals
V
IL
(n) Input Low Voltage — — 0.8 V
V
IH
(n) Input High Voltage 2.0 — — V
I
LEAK
(n) Input Leakage Current — — ±10 µA
C
IN
(n) Input Capacitance 3.0 — 6.0 pF
V
IL
(o) Input Low Voltage — 0 — V
V
IH
(o) Input High Voltage 0.660 0.710 0.850 V