on a partitioned system, follow the procedures from the partition that owns the
resource. If the resource is not owned, follow the procedure from the primary
partition.
For cards in the Models 830/SB2 CEC/System Unit:
v No card positions in the (top) CEC/System Unit permit concurrent maintenance.
You must power down the system to exchange a card. See “Models 830/SB2
with FC 9074 – Cards – Dedicated” on page 658.
For Models 830/SB2 Base I/O Tower cards (FC 9074) – except IXS cards:
v Card positions C01 through C07 and C09 through C15 permit concurrent
maintenance using HSM. You can power down the individual card slot, but you
can NOT power down the tower.
v If the resource is the load source IOA or the load source IOP for the system or
primary partition, it must have mirrored protection in order to use concurrent
maintenance. See “Determining the Load Source Disk and Alternate IPL Device”
on page 944.
v If the resource is the load source IOA or the load source IOP for a secondary
partition, then power down the secondary partition and follow the procedure
from the primary partition.
v If the resource is the console IOA or the console IOP for the system or primary
partition you will loose the console once you power down the domain. Follow
the instructions on the screen when you use HSM to power down the IOP or
IOA. They will tell you how to use function 68 and function 69 on the control
panel.
v If the resource is the console IOA or the console IOP for a secondary partition
you will loose the console once you power down the domain. Follow the
procedure from the primary partition, then from the ″Work with partition status″
screen do a function 69 for the partition.
v All other card positions require dedicated maintenance. See “Models 830/SB2
with FC 9074 – Cards – Dedicated” on page 658.
For Models 830/SB2 Base I/O Tower (FC 9074) IXS cards:
v The IXS card in card positions C05 or C11 require dedicated maintenance. See
“Models 830/SB2 with FC 9074 – Cards – Dedicated” on page 658.
From the Hardware Service Manager screen perform the following:
1. Select the Packaging hardware resources option.
2. Select the Hardware contained in packaging option for the frame ID that you are
working on.
3. Find the card position for the IOA or IOP that you are removing and select
the Concurrent maintenance option.
Attention: If multiple resources are shown with the same card position, one
or more of these resources will show a status of MISSING (″?″ after the
description). Only one resource will be listed as not missing. Select this
resource for the concurrent maintenance operation.
4. A listing of the power domain is shown. Find the IOA or IOP that you are
removing and select the Power off domain option. Everything within the IOA’s
or IOP’s power domain will be powered off .
5. To see the status of the power domain, select the Display power status option.
6. Find the IOA or IOP that you are removing and select the Toggle LED blink
off/on option.
Remove and Replace Procedures
656
iSeries Model 830, 840, SB2, and SB3 Problem Analysis, Repair and Parts V5R1
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