6 - 7
PN 074-550-P1D
SQC-310 Operating Manual
Crystal Fail is displayed
during deposition before
“normal” life of crystal is
exceeded.
Crystal is being hit by small
droplets of molten material
from the evaporation source.
Use a shutter to shield the
sensor during source
conditioning.
Move the crystal farther away
(at least 25.4 cm (10 in.))
from the source.
Damaged crystal or
deposited material is causing
stress to crystal.
Replace the crystal.
Use an Alloy crystal if
appropriate for deposited
material.
Material build-up on crystal
holder is partially masking
the crystal surface.
Clean or replace the crystal
holder. Refer to the sensor
operating manual for
cleaning instructions.
Shutter is partially
obstructing deposition flux or
sensor is poorly positioned,
causing uneven distribution
of material on crystal.
Visually check crystal for an
uneven coating, and if
present, correct shutter or
sensor positioning problem.
Xtal Quality or Xtal Stability
are enabled and triggering a
Crystal Fail.
Poor Rate control is
triggering Xtal Quality (see
section 7.5 on page 7-5).
Unstable/noisy crystal is
triggering Xtal Stability.
Replace crystal.
External condition (e-beam
arcing, thermal changes,
etc.) is triggering Xtal
Stability. Correct the external
condition.
Xtal Quality and/or Xtal
Stability settings are too
sensitive for the application.
Change the values, or
disable Xtal Quality and/or
Xtal Stability (refer to section
3.11 on page 3-18).
Table 6-1 Symptom/Cause/Remedy Chart (continued)
SYMPTOM CAUSE REMEDY
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