Intel Pentium 4 User Manual

Introduction
R
12 Intel
®
Pentium
®
4 Processor / Intel
®
850 Chipset Family Platform Design Guide
Figure 96. Modem Codecs.............................................................................................. 142
Figure 97. Audio and Modem Codecs............................................................................. 142
Figure 98. Audio Codecs................................................................................................. 143
Figure 99. Audio and Audio/Modem Codecs................................................................... 143
Figure 100. CDC_DN_ENAB# Support Circuitry for a Single Codec Motherboard......... 145
Figure 101. CDC_DN_ENAB# Support Circuitry for Multi-Channel Audio Upgrade ....... 146
Figure 102. CDC_DN_ENAB# Support Circuitry for Two-Codecs on Motherboard /
One-Codec on CNR................................................................................................. 146
Figure 103. CDC_DN_ENAB# Support for Two-Codecs on Motherboard /
Two-Codecs on CNR ............................................................................................... 147
Figure 104. USB Data Signals ........................................................................................ 149
Figure 105. SMBUS/SMLink Interface ............................................................................ 150
Figure 106. Unified VCC_Suspend Architecture ............................................................. 152
Figure 107. Unified VCC_Core Architecture ................................................................... 152
Figure 108. Mixed VCC_Suspend/VCC_Core Architecture ............................................ 153
Figure 109. PCI Bus Layout Example ............................................................................. 153
Figure 110. Example PCI Power Planes on Layer 2 ....................................................... 154
Figure 111. Example PCI Routing on Layer 1................................................................. 155
Figure 112. Example PCI Routing on Layer 4................................................................. 156
Figure 113. External Circuitry for the Intel
®
ICH2 RTC ................................................... 157
Figure 114. Diode Circuit to Connect RTC External Battery ........................................... 159
Figure 115. RTCRST External Circuit for the Intel
®
ICH2 RTC....................................... 160
Figure 116. RTC Power-Well Isolation Control ............................................................... 161
Figure 117. Intel
®
ICH2 / LAN Connect Section .............................................................. 163
Figure 118. Single Solution Interconnect ........................................................................ 164
Figure 119. LOM/CNR Interconnect................................................................................ 165
Figure 120. LAN_CLK Routing Example......................................................................... 166
Figure 121. Trace Routing............................................................................................... 168
Figure 122. Ground Plane Separation............................................................................. 169
Figure 123. Intel
®
82562 EH Termination........................................................................ 173
Figure 124. Critical Dimensions for Component Placement ........................................... 174
Figure 125. Intel
®
82562ET/ 82562EM Termination........................................................ 176
Figure 126. Critical Dimensions for Component Placement ........................................... 177
Figure 127. Termination Plane ........................................................................................ 179
Figure 128. Intel
®
82562ET/EM Disable Circuit .............................................................. 180
Figure 129. Dual Footprint LAN Connect Interface ......................................................... 181
Figure 130. Dual Footprint Analog Interface ................................................................... 181
Figure 131. Example Intel
®
ICH2 Top Layer Breakout Using Standard Size Vias .......... 183
Figure 132. Example Intel
®
ICH2 Bottom layer Breakout Using Standard Size Vias ...... 184
Figure 133. FWH VPP Isolation Circuitry ........................................................................ 185
Figure 134. SPKR Circuit ................................................................................................ 187
Figure 135. Example Power-On 3.3 V / 1.8 V Sequencing Circuit.................................. 188
Figure 136. Example PCI IRQ Routing ........................................................................... 189
Figure 137. RM Keepout Drawing 1 ................................................................................ 192
Figure 138. RM Keepout Drawing 2 ................................................................................ 193
Figure 139. Intel
®
MCH Keepouts and RM Hole Locations............................................. 194
Figure 140. FMB1 VR Component Placement................................................................ 198
Figure 141. Four-Phase VR Component Placement....................................................... 199
Figure 142. Three-Phase VR Component Placement..................................................... 199
Figure 143. Decoupling Placement ................................................................................. 201
Figure 144. Four-Phase Decoupling Placement ............................................................. 203
Figure 145. Three-Phase Decoupling Placement ........................................................... 204
Figure 146. Top Layer Power Delivery Shape (VCC_CPU) ............................................ 205
Figure 147. Layer 2 Power Delivery Shape (VSS) .......................................................... 206

Intel Pentium 4 Specifications

General

Brand	Intel
Model	Pentium 4
Category	Computer Hardware
Language	English