Intel Pentium 4 User Manual

Layout Review Checklist
R
Intel
®
Pentium
®
4 Processor / Intel
®
850 Chipset Family Platform Design Guide 285
16.4.4 AGP Connector Decoupling
√ Recommendations Reason/Impact
• One 0.01 µF capacitor next to each power
pin on connector, VCC1_5, V
DDQ
, +5, +12,
3.3VAUX.
• Refer to Section 7.1.11.
• For Bulk decoupling, need one 10 µF
tantalum capacitor to V
DDQ
and a 20 µF
tantalum capacitor on VCC3_3 plane near
connector.
• Refer to Section 7.1.11.
16.5 8 Bit Hub Interface
√ Recommendations Reason/Impact
• Board impedance needs to be
60
Ω ±15%
• Refer to Section 8.2.
• Traces need to be routed 5 mils wide with
20 mils spacing
• Refer to Section 8.2.
• To breakout of the MCH and ICH2 package
the hub interface signals can be routed 5 on
5. Signals need to be separated to 5 on 20
within 300 mils of the package.
• Refer to Section 8.2.
• Max trace length is 6 inches long. • Refer to Section 8.2.
• Data signals must be matched within
±0.1 inches of the HL_STB diff pair.
• Refer to Section 8.2.2.
• Each strobe signal needs to be the same
length.
• Refer to Section 8.2.2.
• HUBREF divider should be placed no more
than 3.5 inches of away from MCH or ICH2.
If so then need separate resistor divider
placed locally.
• Refer to Section 8.2.3.
16.5.1 Hub Decoupling
√ Recommendations Reason/Impact
• Two 0.1 µF capacitors per each component
(MCH and ICH2) spread over the Hub
Interface.
• Refer to Section 8.2.5.
• Place within 150 mils of each package. • Refer to Section 8.2.5.

Intel Pentium 4 Specifications

General

Architecture	x86
Core Count	1
Microarchitecture	NetBurst
Manufacturer	Intel
Core Names	Willamette, Northwood, Prescott, Cedar Mill
Virtualization Technology	No
Release Date	November 20, 2000
Clock Speed	1.3 GHz to 3.8 GHz
FSB Speed	400 MHz to 1066 MHz
Socket	Socket 423, Socket 478, LGA 775
Introduced	2000
Product Line	Pentium
Front Side Bus	400 MHz to 1066 MHz
Hyper-Threading	Yes (Prescott and later)
64-bit Support	Yes (Prescott and later)
Instruction Set	MMX, SSE, SSE2, SSE3
Discontinued	2008
Process Technology	180 nm, 130 nm, 90 nm, 65 nm
L2 Cache	256 KB, 512 KB, 1 MB, 2 MB
Lithography	180 nm, 130 nm, 90 nm, 65 nm
L1 Cache	8 KB