Intel Pentium 4 User Manual

Intel® Pentium® 4 Processor in the 478-Pin Package Processor Power Distribution Guidelines
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Intel
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Pentium
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4 Processor / Intel
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850 Chipset Family Platform Design Guide 205
11.1.5 FMB1 Layout (6-Layer Board)
All six layers in the processor area should be used for power delivery. Four layers should be used
for VCC_CPU and two layers should be used for ground. Traces are not sufficient for supplying
power to the processor due to the high current and low resistance required to meet the processor
voltage specifications. To satisfy these requirements shapes that encompasses the power delivery
part of the processor pin field are required. Figure 146 through Figure 151 show examples of how
to use shapes to delivery power to the processor.
Figure 146. Top Layer Power Delivery Shape (VCC_CPU)

Intel Pentium 4 Specifications

General

Architecture	x86
Core Count	1
Microarchitecture	NetBurst
Manufacturer	Intel
Core Names	Willamette, Northwood, Prescott, Cedar Mill
Virtualization Technology	No
Release Date	November 20, 2000
Clock Speed	1.3 GHz to 3.8 GHz
FSB Speed	400 MHz to 1066 MHz
Socket	Socket 423, Socket 478, LGA 775
Introduced	2000
Product Line	Pentium
Front Side Bus	400 MHz to 1066 MHz
Hyper-Threading	Yes (Prescott and later)
64-bit Support	Yes (Prescott and later)
Instruction Set	MMX, SSE, SSE2, SSE3
Discontinued	2008
Process Technology	180 nm, 130 nm, 90 nm, 65 nm
L2 Cache	256 KB, 512 KB, 1 MB, 2 MB
Lithography	180 nm, 130 nm, 90 nm, 65 nm
L1 Cache	8 KB