Intel Pentium 4 User Manual

Layout Review Checklist
R
272 Intel
®
Pentium
®
4 Processor / Intel
®
850 Chipset Family Platform Design Guide
16.1.4 Processor Decoupling
√ Recommendations Reason/Impact/Documentation
• Place ten 560 µF OS-CON capacitors as
close to the processor power and ground
pins as the heatsink keepout area will allow.
Refer to Chapter 11 for more detailed
placement guidelines.
• These capacitors are needed to meet the
processor voltage transient specifications.
• Place 30 1206 package 10 µF capacitors as
close to processor ground and power pins
as possible. Refer to Chapter 11 for more
detailed placement guidelines.
• These high frequency decoupling capacitors
are needed to meet voltage transients.
• Refer to Chapter 11.
• All capacitors should be placed as close to
the processor package as the processor
keep-out zone allows.
• Refer to Chapter 11.
16.1.5 Intel
®
82850 MCH Decoupling
√ Recommendations Reason/Impact/Documentation
• 4–5 0.1 µF capacitors with 603 packages
distributed evenly over the system bus data
lines. Place as close as possible (within
150 mils) to the chipset package.
• This recommendation reduces return path
discontinuities that result from system board
traces having only one reference plane
(microstrip).
• Refer to Section 5.5.1
• V
CC
RAC isolation: Low pass filter circuit
should be located within 2 inches of the
MCH and the layout of V
CC
RAC
connections should follow high-speed
design practices. Decoupling capacitors
should be placed as close to the RAC pins
as possible to control self-induced RAC
noise.
• Proper routing of V
CC
RAC isolation ensures
RAMBUS clock jitter specifications are met.
• Refer to Section 12.3.
• 2–3 0.1 µF capacitors with 603 packages
distributed evenly over the system bus
address and control lines. Place as close
as possible (within 150 mils) to the chipset
package.
• This recommendation reduces return path
discontinuities that result from system board
traces having only one reference plane.
These recommendations are only used for
designs containing microstrip
configurations.
• Refer to Section 5.5.1

Intel Pentium 4 Specifications

General

Architecture	x86
Core Count	1
Microarchitecture	NetBurst
Manufacturer	Intel
Core Names	Willamette, Northwood, Prescott, Cedar Mill
Virtualization Technology	No
Release Date	November 20, 2000
Clock Speed	1.3 GHz to 3.8 GHz
FSB Speed	400 MHz to 1066 MHz
Socket	Socket 423, Socket 478, LGA 775
Introduced	2000
Product Line	Pentium
Front Side Bus	400 MHz to 1066 MHz
Hyper-Threading	Yes (Prescott and later)
64-bit Support	Yes (Prescott and later)
Instruction Set	MMX, SSE, SSE2, SSE3
Discontinued	2008
Process Technology	180 nm, 130 nm, 90 nm, 65 nm
L2 Cache	256 KB, 512 KB, 1 MB, 2 MB
Lithography	180 nm, 130 nm, 90 nm, 65 nm
L1 Cache	8 KB