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Intel Pentium 4 User Manual

Intel Pentium 4
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Layout Review Checklist
R
Intel
®
Pentium
®
4 Processor / Intel
®
850 Chipset Family Platform Design Guide 287
16.9 USB
Recommendations Reason/Impact
Characteristic impedance of individual
signal lines P+, P- Zo = 45
(90
Differential)
Refer to Section 9.4.
Stack-up: 9 mils wide, 25 mil spacing
between Differential pairs
Refer to Section 9.4.
Trace Characteristics:
Line Delay = 160.2 ps
Capacitance = 3.5 pF
Inductance = 7.3 nH
Res @ 20o C = 53.9 m
Refer to Section 9.4.
15 series resistor to be placed < 1 inch
from ICH2
This is required for source termination of the
reflected signal.
Refer to Section 9.4.
47 pF parallel capacitors should be placed
as close to the ICH2 as possible
Refer to Section 9.4.
15 k + 5% pull-down resistors should be
placed as close to the ICH2 as possible.
Refer to Section 9.4.
Optional 47 pF capacitor placed close to the
USB connector as possible to the USB data
lines
This capacitor can be used for signal quality
(rise/fall) times and to help minimize EMI
radiation
Refer to Section 9.4 of this document.
Stub length due to 15 k pull-downs should
be as short as possible.
Refer to Section 9.4.
16.10 Intel
®
ICH2 Decoupling
Recommendations Reason/Impact
3.3 V Core—six 0.1 µF capacitors Refer to Section 9.12.
3.3 V Stand By –one 0.1 µF capacitor Refer to Section 9.12.
Processor I/F (Vcc
_Core
) –one 0.1µF
capacitor
Refer to Section 9.12.
1.8 V Core–two 0.1 µF capacitors, already
included in Hub decoupling
Refer to Section 9.12.
Place Decoupling capacitors as close to the
ICH2 as possible (~ 400 mils)
Refer to Section 9.12.

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Intel Pentium 4 Specifications

General IconGeneral
Architecturex86
Core Count1
MicroarchitectureNetBurst
ManufacturerIntel
Core NamesWillamette, Northwood, Prescott, Cedar Mill
Virtualization TechnologyNo
Release DateNovember 20, 2000
Clock Speed1.3 GHz to 3.8 GHz
FSB Speed400 MHz to 1066 MHz
SocketSocket 423, Socket 478, LGA 775
Introduced2000
Product LinePentium
Front Side Bus400 MHz to 1066 MHz
Hyper-ThreadingYes (Prescott and later)
64-bit SupportYes (Prescott and later)
Instruction SetMMX, SSE, SSE2, SSE3
Discontinued2008
Process Technology180 nm, 130 nm, 90 nm, 65 nm
L2 Cache256 KB, 512 KB, 1 MB, 2 MB
Lithography180 nm, 130 nm, 90 nm, 65 nm
L1 Cache8 KB

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