Intel Pentium 4 User Manual

I/O Controller Hub 2
R
Intel
®
Pentium
®
4 Processor / Intel
®
850 Chipset Family Platform Design Guide 181
9.9.6 82562ET / 82562EH Dual Footprint Guidelines
These guidelines characterize the proper layout for a dual footprint solution. This configuration
enables the developer to install either the 82562EH or the 82562ET/82562EM components while
having only one motherboard design. The following are guidelines for the 82562ET/82562EH
Dual Footprint option. The dual footprint for this particular solution uses a SSOP footprint for
82562ET and a TQFP footprint for 82562EH. The combined footprint for this configuration is
shown in Figure 129 and Figure 130.
Figure 129. Dual Footprint LAN Connect Interface
LAN_dual-footprint_conn
ICH2
LAN_TXD[2:0]
LAN_RXD[2:0]
LAN_RSTSYNC
LAN_CLK
L
8
2
5
6
2
E
T
S
S
O
P
Stub
82562EH
TQFP
Figure 130. Dual Footprint Analog Interface
LAN_dual_footprint_analog_IF
Magnetics
module
TDP
RJ45
82562EH/82562ET
TDN
RDP
RDN
RJ11
TXP
TXN
Tip
Ring
82562EH
config.
82562ET
config.

Intel Pentium 4 Specifications

General

Architecture	x86
Core Count	1
Microarchitecture	NetBurst
Manufacturer	Intel
Core Names	Willamette, Northwood, Prescott, Cedar Mill
Virtualization Technology	No
Release Date	November 20, 2000
Clock Speed	1.3 GHz to 3.8 GHz
FSB Speed	400 MHz to 1066 MHz
Socket	Socket 423, Socket 478, LGA 775
Introduced	2000
Product Line	Pentium
Front Side Bus	400 MHz to 1066 MHz
Hyper-Threading	Yes (Prescott and later)
64-bit Support	Yes (Prescott and later)
Instruction Set	MMX, SSE, SSE2, SSE3
Discontinued	2008
Process Technology	180 nm, 130 nm, 90 nm, 65 nm
L2 Cache	256 KB, 512 KB, 1 MB, 2 MB
Lithography	180 nm, 130 nm, 90 nm, 65 nm
L1 Cache	8 KB