Intel Pentium 4 User Manual

Platform Placement and Stack-Up Overview
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36 Intel
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Pentium
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4 Processor / Intel
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850 Chipset Family Platform Design Guide
3.2 Motherboard Layer Stack-Up
3.2.1 Six-Layer Motherboard Stack-Up
Figure 8 shows a six-layer stack-up for the system. It is for reference only and the actual board
stack-up may vary depending upon the following considerations. The separation between layers 2
and 3 should be kept as large as possible. A distance greater than 2x should be kept between
signals on layers 2 and signals on layer 3. Additionally, traces on layer 2 should be routed
orthogonally to traces on layer 3. If traces on layer 2 are unable to be routed orthogonally to traces
on layer 3, then the distance between layer 2 and layer 3 should be greater than 4x.
Figure 8. Six Layer Stack-Up
6-Layer_stackup
6 Layers
Layer 0
Layer 1Vcc Plane
Signal
Layer 2 Signal
Layer 3
Layer 4
Signal
Layer 5 Signal
Vss Plane

Intel Pentium 4 Specifications

General

Architecture	x86
Core Count	1
Microarchitecture	NetBurst
Manufacturer	Intel
Core Names	Willamette, Northwood, Prescott, Cedar Mill
Virtualization Technology	No
Release Date	November 20, 2000
Clock Speed	1.3 GHz to 3.8 GHz
FSB Speed	400 MHz to 1066 MHz
Socket	Socket 423, Socket 478, LGA 775
Introduced	2000
Product Line	Pentium
Front Side Bus	400 MHz to 1066 MHz
Hyper-Threading	Yes (Prescott and later)
64-bit Support	Yes (Prescott and later)
Instruction Set	MMX, SSE, SSE2, SSE3
Discontinued	2008
Process Technology	180 nm, 130 nm, 90 nm, 65 nm
L2 Cache	256 KB, 512 KB, 1 MB, 2 MB
Lithography	180 nm, 130 nm, 90 nm, 65 nm
L1 Cache	8 KB