Intel Pentium 4 User Manual

Power Distribution Guidelines
R
230 Intel
®
Pentium
®
4 Processor / Intel
®
850 Chipset Family Platform Design Guide
12.2.1 ACPI Hardware Model
The Intel 850 chipset-based desktop supports both legacy and ACPI operations, which involves
sequencing the platform between the various global system states (G0–G3). Figure 171 depicts
global states and the transitions. For complete detail of the mechanisms involved in transition from
any of the global states refer to the ACPI Interface Specification 1.0a, Section 4.5.
Figure 171. Global System Power States and Transition
PWR_Global_State_Trans
Processor Power State
C1 C2
G3-Mech
Off
G0(S0,C0)-
Working
G2(S5)-
Soft Off
G1 (Sleep State)
S3
S4
S1
12.2.2 Thermal Design Power
The thermal design power numbers are estimation of the maximum expected power generated by a
component in a realistic application. It is based on extrapolations in both hardware and software
technology over the product life. It does not represent the expected power generated by a power
virus. The ICC max sustained (WCRA) numbers are estimation of the maximum expected current
generated within a die section in a realistic application such as an application that executes
extensive memory reads/writes.
Refer to the Intel

850 Chipset: Thermal Considerations Application Note (AP-720) and the Intel
®
850 Chipset: 82850 Memory Controller Hub (MCH) Datasheet for additional thermal package
characteristics.

Intel Pentium 4 Specifications

General

Architecture	x86
Core Count	1
Microarchitecture	NetBurst
Manufacturer	Intel
Core Names	Willamette, Northwood, Prescott, Cedar Mill
Virtualization Technology	No
Release Date	November 20, 2000
Clock Speed	1.3 GHz to 3.8 GHz
FSB Speed	400 MHz to 1066 MHz
Socket	Socket 423, Socket 478, LGA 775
Introduced	2000
Product Line	Pentium
Front Side Bus	400 MHz to 1066 MHz
Hyper-Threading	Yes (Prescott and later)
64-bit Support	Yes (Prescott and later)
Instruction Set	MMX, SSE, SSE2, SSE3
Discontinued	2008
Process Technology	180 nm, 130 nm, 90 nm, 65 nm
L2 Cache	256 KB, 512 KB, 1 MB, 2 MB
Lithography	180 nm, 130 nm, 90 nm, 65 nm
L1 Cache	8 KB