Intel Pentium 4

Platform Placement and Stack-Up Overview
R
Intel
®
Pentium
®
4 Processor / Intel
®
850 Chipset Family Platform Design Guide 37
3.2.2 Design Considerations
• Standard vias should be 14 mil hole with a 26 mil pad.
Figure 9. Example Stack-Up for 6-Layer ATX Form Factor
Tolerance
(±m ils)
Bot - Signal
(plated 1/2oz Cu)
B
A
Stack_ATX_850-P4
1 oz L2 / L5
Thickness
(m ils)
Top - Signal
(plated 1/2oz Cu)
2.1 mils
2.1 0.4
40.3
L2 - Power
(unplated 1oz Cu)
1.2 mils
1.2 0.2
4.3 0.5
L3 - Signal
(unplated 1oz Cu)
1.2 mils
1.2 0.2
6.5 mils
6.5 0.5
Core
23 0.5
6.5 m ils
6.5 0.5
L4 - Signal
(unplated 1oz Cu)
1.2 mils
1.2 0.2
4.3 0.5
L5 - Ground
(unplated 1oz Cu)
1.2 mils
1.2 0.2
40.3
2.1 mils
2.1 0.4
Total
61.6 4.7
B
C
D
E
F
E
D
C
A