Intel 8253 - Page 194

4-17
Die Characteristics
DIE DIMENSIONS:
129mils x 155mils x 19mils
(3270µm x 3940µm x 483µm)
METALLIZATION:
Type: Si-Al-Cu
Thickness: Metal 1: 8k
Å ± 0.75kÅ
Metal 2: 12kÅ ± 1.0kÅ
GLASSIVATION:
Type: Nitrox
Thickness: 10k
Å ± 3.0kÅ
Metallization Mask Layout
82C54
CS
A1
A0
CLK2
OUT2
GATE2
D4
D3
D2
D1
D0
CLK0
D5 D6 D7 VCC
WR RD
OUT0 GATE0 GND OUT1 GATE1 CLK1
82C54