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Intel 8253 - Page 680

Intel 8253
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4-20
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate
and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site http://www.intersil.com
Die Characteristics
DIE DIMENSIONS:
143 x 130 x 19 ±1mils
(3630 x 3310 x 525µm)
METALLIZATION:
Type: Si-Al-Cu
Thickness: Metal 1: 8k
Å ± 0.75kÅ
Metal 2: 12kÅ ± 1.0kÅ
GLASSIVATION:
Type: Nitrox
Thickness: 10k
Å ± 3.0kÅ
Metallization Mask Layout
82C59A
D7
RD
WR
CS
V
CC
INTA
CAS0
CAS1
GND
CAS2
SP/EN
INT
D0 D1 D2 D3 D4 D5
IR1 IR2 IR3 IR4 IR5 IR6
A0
D6
IR0
IR7
82C59A

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