Intel 8253 - Page 656

22
Die Characteristics
DIE DIMENSIONS:
95 x 100 x 19 ±1mils
METALLIZATION:
Type: Silicon - Aluminum
Thickness: 11k
Å ±1kÅ
GLASSIVATION:
Type: SiO
2
Thickness: 8kÅ ±1kÅ
WORST CASE CURRENT DENSITY:
0.78 x 10
5
A/cm
2
Metallization Mask Layout
82C55A
RD PA0 PA1 PA2 PA3 PA4 PA5 PA6 PA7 WR
CS
GND
A1
A0
PC7
PC6
PC5
PC4
PC0
PC1
PC2 PD3 PB0 PB1 PB2 PB3 PB4 PB5 PB6 PB7
V
CC
D7
D6
D5
D4
D3
D2
D1
D0
RESET
82C55A