Intel 8253 - Page 709

Philips Semiconductors Linear Products Product specification
DAC08 Series8-Bit high-speed multiplying D/A converter
August 31, 1994
717
ORDERING INFORMATION
DESCRIPTION TEMPERATURE RANGE ORDER CODE DWG #
16-Pin Hermetic Ceramic Dual In-Line Package (Cerdip) -55°C to +125°C DAC08F 0582B
16-Pin Hermetic Ceramic Dual In-Line Package (Cerdip) -55°C to +125°C DAC08AF 0582B
16-Pin Plastic Dual In-Line Package (DIP) 0 to +70°C DAC08CN 0406C
16-Pin Hermetic Ceramic Dual In-Line Package (Cerdip) 0 to +70°C DAC08CF 0582B
16-Pin Plastic Dual In-Line Package (DIP) 0 to +70°C DAC08EN 0406C
16-Pin Hermetic Ceramic Dual In-Line Package (Cerdip) 0 to +70°C DAC08EF 0582B
16-Pin Plastic Small Outline (SO) Package 0 to +70°C DAC08ED 0005D
16-Pin Plastic Dual In-Line Package (DIP) 0 to +70°C DAC08HN 0406C
BLOCK DIAGRAM
BIAS
NETWORK
CURRENT
SWITCHES
MSB LSB
V+
13 1 5 6 7 8 9 10 11 12
14
15
16
3
4
2
COMP. V–
REFERENCE
AMPLIFIER
V
REF
(+)
V
REF
(–)
B
1
V
LC
B
2
B
3
B
4
B
5
B
6
B
7
B
8
I
OUT
+
–
I
OUT
ABSOLUTE MAXIMUM RATINGS
SYMBOL PARAMETER RATING UNIT
V+ to V- Power supply voltage 36 V
V
5
-V
12
Digital input voltage V- to V- plus 36V
V
LC
Logic threshold control V- to V+
V
0
Applied output voltage V- to +18 V
I
14
Reference current 5.0 mA
V
14
, V
15
Reference amplifier inputs V
EE
to V
CC
P
D
Maximum power dissipation T
A
=25°C
(still-air)
1
F package 1190 mW
N package 1450 mW
D package 1090 mW
T
SOLD
Lead soldering temperature (10sec max) 300 °C
T
A
Operating temperature range
DAC08, DAC08A -55 to +125 °C
DAC08C, E, H 0 to +70 °C
T
STG
Storage temperature range -65 to +150 °C
NOTES:
1. Derate above 25°C, at the following rates:
F package at 9.5mW/°C
N package at 11.6mW/°C
D package at 8.7mW/°C