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Texas Instruments TMS320C6455 User Manual

Texas Instruments TMS320C6455
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TMS320C6455
SPRS276M MAY 2005REVISED MARCH 2012
www.ti.com
Table 7-112. RapidIO Control Registers (continued)
HEX ADDRESS RANGE ACRONYM REGISTER NAME
02D1 4308 RIO_SP3_SILENCE_TIMER Port 3 Silence Timer Register
02D1 430C RIO_SP3_MULT_EVNT_CS Port 3 Multicast-Event Control Symbol Request Register
02D1 4310 - Reserved
02D1 4314 RIO_SP3_CS_TX Port 3 Control Symbol Transmit Register
02D1 4318 - 02D2 0FFF - Reserved
02D2 1000 - 02DF FFFF - Reserved
7.20.3 Serial RapidIO Electrical Data/Timing
The Implementing Serial RapidIO PCB Layout on a TMS320CTI6482 Hardware Design application report
(literature number SPRAAA8) specifies a complete printed circuit board (PCB) solution for the C6455 as
well as a list of compatible SRIO devices showing two DSPs connected via a 4x SRIO link. TI has
performed the simulation and system characterization to ensure all SRIO interface timings in this solution
are met; therefore, no electrical data/timing information is supplied here for this interface.
TI only supports designs that follow the board design guidelines outlined in the SPRAAA8
application report.
244 C64x+ Peripheral Information and Electrical Specifications Copyright © 2005–2012, Texas Instruments Incorporated
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Table of Contents

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Texas Instruments TMS320C6455 Specifications

General IconGeneral
Clock Speed1.0 GHz
Core Count1
On-Chip RAMYes
Data Width32-bit
Data Bus Width64-bit
Operating Voltage1.2 V
I/O Voltage3.3 V
Instruction SetTMS320C64x+
MemoryDDR2
Package TypeBGA
External Memory InterfaceEMIF
InterfacesI2C, SPI

Summary

1 Features

2 Device Overview

2.2 CPU (DSP Core) Description

Details the C64x+ CPU core, functional units, register files, and data paths.

2.4 Boot Sequence

Explains the process of initializing the DSP's memory and registers at reset.

3 Device Configuration

3.1 Device Configuration at Device Reset

Details configuration pins (AEA, ABA, PCI_EN) for boot mode, clock source, and endianness.

5 C64x+ Megamodule

5.1 Memory Architecture

Describes the L2, L1P, and L1D memory configurations and sizes.

6 Device Operating Conditions

6.1 Absolute Maximum Ratings Over Operating Case Temperature Range (Unless Otherwise Noted)

Specifies stress ratings for voltage, temperature, and other conditions beyond which damage may occur.

6.2 Recommended Operating Conditions

Lists recommended operating ranges for supply voltages, input/output, and temperatures.

7 C64x+ Peripheral Information and Electrical Specifications

7.3 Power Supplies

Covers power supply sequencing, decoupling, and power-down operation.

7.4 Enhanced Direct Memory Access (EDMA3) Controller

Details EDMA3 features like transfer dimensions, PaRAM entries, and DMA channels.

7.6 Reset Controller

Describes different reset types (POR, Warm, Max, System, CPU) and their effects.

7.7 PLL1 and PLL1 Controller

Details PLL1 controller operation, clocks, and registers for frequency synthesis.

7.8 PLL2 and PLL2 Controller

Describes PLL2 controller operation, clocks, and registers for EMAC and DDR2 memory.

7.9 DDR2 Memory Controller

Explains DDR2 interface, device-specific information, and memory topologies.

7.10 External Memory Interface A (EMIFA)

Covers EMIFA interface capabilities for various external devices and timing.

7.11 I2C Peripheral

Describes the I2C module, its features, and device-specific information.

7.14 Ethernet MAC (EMAC)

Describes EMAC module, interface modes (MII, RMII, GMII, RGMII), and control modules.

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