Texas Instruments TMS320C6455

TMS320C6455
www.ti.com SPRS276M –MAY 2005–REVISED MARCH 2012
8 Mechanical Data
8.1 Thermal Data
Table 8-1 shows the thermal resistance characteristics for the PBGA - CTZ/GTZ/ZTZ mechanical
package.
Table 8-1. Thermal Resistance Characteristics (S-PBGA Package) [CTZ/GTZ/ZTZ]
AIR FLOW
NO. °C/W
(m/s)
(1)
1 RΘ
JC
Junction-to-case 1.45 N/A
2 RΘ
JB
Junction-to-board 8.34 N/A
3 16.1 0.00
4 13.0 1.0
RΘ
JA
Junction-to-free air
5 11.9 2.0
6 10.7 3.0
0.37 0.00
0.89 1.0
7 Psi
JT
Junction-to-package top
1.01 1.5
1.17 3.00
7.6 0.00
6.7 1.0
8 Psi
JB
Junction-to-board
6.4 1.5
5.8 3.00
(1) m/s = meters per second
8.2 Packaging Information
The following packaging information reflects the most current released data available for the designated
device(s). This data is subject to change without notice and without revision of this document.
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