Freescale Semiconductor FlexRay MFR4310 - Table A-5. Thermal Package Simulation Details

Electrical Characteristics
MFR4310 Reference Manual, Rev. 2
Freescale Semiconductor 243
Table A-5. Thermal Package Simulation Details
Num Rating Symbol Value Unit
1 Junction to Ambient LQFP64, single sided PCB
1
, Natural Convection
1
Junction-to-Ambient Thermal Resistance determined per JEDEC JESD51-3 and JESD51-6. Thermal test board meets JEDEC
specification for this package.
R
θJA
67
o
C/W
2 Junction to Ambient LQFP64, double sided PCB with 2 internal planes
1
, Natural
Convection
R
θJMA
48
o
C/W
3 Junction to Ambient LQFP64 (@200 ft/min), single sided PCB
1
R
θJMA
55
o
C/W
4 Junction to Ambient LQFP64 (@200 ft/min), double sided PCB with 2 internal planes
1
R
θJMA
42
o
C/W
5 Junction to Board LQFP64
2
2
Junction-to-Board thermal resistance determined per JEDEC JESD51-8. Thermal test board meets JEDEC specification for
the specified package.
R
θJB
31
o
C/W
6 Junction to Case LQFP64
3
3
Junction-to-Case at the top of the package determined using MIL-STD 883 Method 1012.1. The cold plate temperature is used
for the case temperature. Reported value includes the thermal resistance of the interface layer.
R
θJC
14
o
C/W
7 Junction to Package Top LQFP64
4
, Natural Convection
4
Thermal characterization parameter indicating the temperature difference between the package top and the junction
temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as
Psi-JT
Ψ
JT
3
o
C/W