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Siemens HiPath 3000 Series - Page 221

Siemens HiPath 3000 Series
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boards.fm
A31003-H3590-S100-7-7620, 06/2012
HiPath 3000/5000 V9, Service documentation
3-89
Nur für den internen Gebrauch Boards for HiPath 3000
Peripheral boards
Front panel
An additional shielding panel is not required on the front side of this board, because the EMC
shield is already provided by the front panel.
Backplane
System interfaces X1 to X9 are located on the backplane. They are designed as SIPAC con-
nectors.
Figure 3-33 DIUT2 - Front Panel (S30810-Q2226-X100)
Two LEDs indicating the board status:
LED (green)
LED (red)
15-pin “Sub-D” interface 2 (X11)
15-pin “Sub-D” interface 1 (X10)

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