Contens
Hardware - SIMADYN D xi
Ausgabe 05.2006
6.8.3 Supplementary components................................................................................ 6-36
6.8.4 Mounting guidelines and noise immunity............................................................. 6-36
6.8.5 SS4 diagnostic functions ..................................................................................... 6-37
6.8.6 Connector assignment X5 ................................................................................... 6-39
6.8.7 Technical data ..................................................................................................... 6-40
6.9 Communication modules SS5, SS52 .................................................................. 6-41
6.9.1 Supplementary components................................................................................ 6-42
6.9.2 Mounting guidelines and noise immunity............................................................. 6-43
6.9.3 Diagnostics LED .................................................................................................. 6-43
6.9.4 Connector assignment X5 ................................................................................... 6-44
6.9.5 Technical data ..................................................................................................... 6-46
7 Technology subrack ..............................................................................................................7-1
7.1 Technology subrack SRT400 ................................................................................ 7-2
7.2 Technology module T400 ...................................................................................... 7-2
7.2.1 General features .................................................................................................... 7-2
7.2.2 Mechanical design, terminals ................................................................................ 7-4
7.2.3 Incremental encoder with coarse- and fine-pulse evaluation ................................ 7-4
7.2.3.1 Pulse encoder 2..................................................................................................... 7-5
7.2.4 Absolute value encoders ....................................................................................... 7-7
7.2.5 Serial interfaces ..................................................................................................... 7-7
7.2.5.1 Bus termination...................................................................................................... 7-8
7.2.5.2 Communications switch ......................................................................................... 7-8
7.2.6 Synchronizing possibilities..................................................................................... 7-9
7.2.7 Parameters .......................................................................................................... 7-10
7.2.8 Terminal assignment ........................................................................................... 7-10
7.2.9 Technical data ..................................................................................................... 7-12
8 Program memory modules / Interface modules.................................................................. 8-1
8.1 Program memory modules MS5, MS51, MS52 ..................................................... 8-2
8.1.1 Technical data ....................................................................................................... 8-3
8.2 Interface module SE13.1 ....................................................................................... 8-4
8.2.1 Application information .......................................................................................... 8-5
8.2.2 Technical data ....................................................................................................... 8-5
8.2.3 Connector assignment X1 ..................................................................................... 8-6
8.3 Interface module SE26.1 ....................................................................................... 8-7
8.3.1 Application information .......................................................................................... 8-8
8.3.2 Technical data ....................................................................................................... 8-9
8.3.3 Connector assignment........................................................................................... 8-9
8.3.4 Diagram ............................................................................................................... 8-10
8.4 Interface module SB10 ........................................................................................ 8-11
8.4.1 Signals ................................................................................................................. 8-12
8.4.2 Application information ........................................................................................ 8-13
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