C64x+ DSP:
C6455
PREFIX
TMS 320 C6455 GTZ
TMX = Experimental device
TMS = Qualified device
DEVICE FAMILY
320 = TMS320 DSP family
PACKAGE TYPE
(B)
CTZ = 697-pin plastic BGA, with Pb-Free die bump and solder balls
GTZ = 697-pin plastic BGA with Pb-ed solder balls
ZTZ = 697-pin plastic BGA, with Pb-Free solder balls
DEVICE
DEVICE SPEED RANGE
( )
7 = 720 MHz
8 = 850 MHz
Blank = 1 GHz
2 = 1.2 GHz
( )
TEMPERATURE RANGE
(A)
Blank = 0°C to 90°C (default commercial temperature)
A = -40°C to 105°C (extended temperature)
2
SILICON REVISION
(C)
B = silicon revision 2.1
D = silicon revision 3.1
TMS320C6455
SPRS276M –MAY 2005–REVISED MARCH 2012
www.ti.com
TI device nomenclature also includes a suffix with the device family name. This suffix indicates the
package type (for example, GTZ), the temperature range (for example, blank is the default commercial
temperature range), and the device speed range, in megahertz (for example, 2 is 1200 MHz [1.2 GHz]).
Figure 2-13 provides a legend for reading the complete device name for any TMS320C64x+™ DSP
generation member.
For device part numbers and further ordering information for TMS320C6455 in the CTZ/GTZ/ZTZ package
type, see the TI website (www.ti.com) or contact your TI sales representative.
A. The extended temperature "A version" devices may have different operating conditions than the commercial
temperature devices. For more details, see Section 6.2, Recommended Operating Conditions.
B. BGA = Ball Grid Array
C. For silicon revision information, see the TMS320C6455/54 Digital Signal Processor Silicon Errata (literature number
SPRZ234).
Figure 2-13. TMS320C64x+™ DSP Device Nomenclature (including the TMS320C6455 DSP)
2.8.2.2 Documentation Support
The following documents describe the TMS320C6455 Fixed-Point Digital Signal Processor. Copies of
these documents are available on the Internet at www.ti.com. Tip: Enter the literature number in the
search box provided at www.ti.com.
SPRU871 TMS320C64x+ DSP Megamodule Reference Guide. Describes the TMS320C64x+ digital
signal processor (DSP) megamodule. Included is a discussion on the internal direct memory
access (IDMA) controller, the interrupt controller, the power-down controller, memory
protection, bandwidth management, and the memory and cache.
SPRU732 TMS320C64x/C64x+ DSP CPU and Instruction Set Reference Guide. Describes the CPU
architecture, pipeline, instruction set, and interrupts for the TMS320C64x and TMS320C64x+
digital signal processors (DSPs) of the TMS320C6000 DSP family. The C64x/C64x+ DSP
generation comprises fixed-point devices in the C6000 DSP platform. The C64x+ DSP is an
enhancement of the C64x DSP with added functionality and an expanded instruction set.
SPRAA84 TMS320C64x to TMS320C64x+ CPU Migration Guide. Describes migrating from the Texas
Instruments TMS320C64x digital signal processor (DSP) to the TMS320C64x+ DSP. The
objective of this document is to indicate differences between the two cores. Functionality in
the devices that is identical is not included.
SPRU889 High-Speed DSP Systems Design Reference Guide. Provides recommendations for
meeting the many challenges of high-speed DSP system design. These recommendations
include information about DSP audio, video, and communications systems for the C5000 and
C6000 DSP platforms.
SPRU965 TMS320C6455 Technical Reference. An introduction to the TMS320C6455 DSP and
discusses the application areas that are enhanced.
52 Device Overview Copyright © 2005–2012, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Link(s): TMS320C6455
To Next Page
Loading...
Need help?
General
