Oracle X7-2 Service Manual

Remove the Motherboard
1.
Prepare the server for service.
a.
Power off the server and disconnect the power cords from the power
supplies.
See “Powering Down the Server” on page 53.
b.
Extend the server to the maintenance position.
See “Extend the Server to the Maintenance Position” on page 59.
c.
Attach an antistatic wrist strap to your wrist, and then to a metal area on the
chassis.
See “Take Antistatic Measures” on page 61.
d.
Remove the server top cover.
See “Remove the Server Top Cover” on page 62.
2.
Remove the following reusable components:
Caution - During the motherboard removal procedure, it is important to label power supplies
with the slot numbers from which they were removed (PS0, PS1). This is required because the
power supplies must be reinstalled into the slots from which they were removed; otherwise, the
server key identity properties (KIP) data might be lost. When a server requires service, the KIP
is used by Oracle to verify that the warranty on the server has not expired. For more information
on KIP, see “FRU Key Identity Properties (KIP) Automated Update” on page 51.
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Air baffles
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Fan modules
See “Remove a Fan Module” on page 81.
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Power supplies
See “Remove a Power Supply” on page 88.
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PCIe risers and attached PCIe cards
See “Servicing PCIe Risers (CRU)” on page 111, “Servicing PCIe Cards
(CRU)” on page 121, and “Servicing the Internal HBA Card and HBA Super Capacitor
(FRU)” on page 169.
Note - Remove the M.2 SATA cable between the PCIe slot 3 riser and the motherboard
SATA connector and set it aside.
200 Oracle Server X7-2 Service Manual • October 2017

Oracle X7-2 Specifications

General

Processor	Intel Xeon Scalable processors
Number of Processors	1 or 2
Memory	Up to 1.5 TB DDR4
Memory Slots	24 DIMM slots
Form Factor	2U Rackmount
Storage Bays	8 x 2.5-inch
CPU Socket	Socket P (LGA 3647)
Power Supply	Redundant hot-swappable power supplies