8-2 Imaging Subsystem
Overview 5DX Series 3
Overview
The Imaging Subsystem consists of all the components required to generate,
acquire and analyze solder joints on a panel. A panel may consist of many
components requiring approximately 100 to 400 different views to analyze the
solder joints. Each view has a corresponding XYZ coordinate set and a specific
Field of View which combine to produce the required slice image.
For clarity in explaining the different tasks, the tasks will be broken down as
follows:
• Image Generation Process — The process that creates an image of the panel
under test.
• Image Acquisition Process — The process that captures an image of the panel
under test.
• Image Analysis — The testing of various parts of an image to determine if the
solder joints are good or bad.
This chapter will cover these topics and provide a further discussion of the
Imaging Subsystem Components. A limited set of confirmation/diagnostics are
available with the 6.0 software, for more information see the chapter on
Confirmation and Diagnostics.
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