HBM MGCplus - Default Chapter; Table of Contents

Table of contents
MGCplus A0534-30.0 HBM: public 3
Table of contents
1 Safety instructions 11.......................................................................
1.1 Electromagnetic compatibility 14........................................................
2 Markings used 15...........................................................................
2.1 Markings on the device 15.............................................................
2.2 The markings used in this document 15..................................................
3 Introduction 17.............................................................................
3.1 Degree of protection 17................................................................
3.2 Notes on documentation 18............................................................
3.3 System description 19.................................................................
3.4 Layout of the MGCplus device 21.......................................................
3.5 MGCplus housing designs 22...........................................................
3.6 Possible amplifier/connection board combination 23.......................................
3.7 Installation of the CP52 communication processor 26......................................
3.8 Conditions at the place of installation 29.................................................
3.9 Maintenance and cleaning 30...........................................................
4 Connection 31.............................................................................
4.1 Connecting the MGCplus in a tabletop housing/rack frame 31...............................
4.1.1 Mains connection 31..........................................................
4.1.2 Synchronization of multiple CP52 devices 32.....................................
4.1.2.1 Synchronization of multiple CP52 devices via a synchronization jack 32.....
4.1.3 Synchronization of CP52 with CP22/CP42 34.....................................
4.2 Shielding design 36...................................................................
4.3 Connecting the transducer 39..........................................................
4.3.1 Connecting separate TEDS modules 39..........................................
4.3.2 SG full bridges, inductive full bridges 42..........................................
4.3.3 Full bridge circuits on AP810i/AP815i 43.........................................