Main Board Intel® Server System S7000FC4UR
Intel order number E18291-001
30
2.2.24 Thermal Specifications
The thermal solution designed to support the board must meet the following conditions:
Table 8. Thermal Specifications
Component Target Velocity Target Ambient Temp Specification
Processors
See Processors Thermal Specifications
Processor sockets 500 lfm 50 °C 100 °C, T
socket
CPU core VRDs 400 lfm 50 °C 90°C, T
sink
@
MAXIMUM
Intel
®
7300 Chipset MCH 400 lfm 50 °C 105 °C, T
HIS
IDT* 89HPES24N3A 400 lfm 50 °C 105 °C, T
die
Intel
®
82563EB Gigabit Ethernet
PHY
400 lfm 50 °C 105 °C, T
case
Enterprise Southbridge 2 400 lfm 50 °C 85 °C, T
case
ATI* RN50 400 lfm 50 °C 85 °C, T
case
Main board 400 lfm 50 °C 100 °C, T
board