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Agilent Technologies 5DX
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Agilent 5DX Service Guide 8-13
5DX Series 3 Imaging Subsystem Components
As the Imaging Subsystem goes through a Frame Acquisition Cycle, the Interface
Card changes the Bank Select inputs to the X-ray Scan Controller to move the
Electron Beam from the Dump Ring to the FOV stored in the selected Bank. At the
end of the Frame Acquisition Cycle, the Electron Beam is deflected back to the
Dump Ring. X-rays are blocked when the Electron Beam hits the Dump Ring.
Dump Ring (Bank 0)
Figure 8-7: Dump Ring
The Electron Beam is deflected to an area surrounding the circumference of the X-
ray Target when the Imaging Subsystem is not generating an image.
The Electron Beam is deflected such that is matches the circumference of the
Dump Ring. The generated X-ray emissions are blocked by the Dump Ring. This
greatly reduces the amount of X-ray exposure or radiation dose to a panel under
test.
Dump Ring
Dump Ring
Side View
Bottom View

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