HP 8560A

Table 4-2. Reference Designations, Abbreviations, and Multipliers (2 of 4)
DAP-GL
Diallyl Phthalate
Glass
DBL
Double
DCDR Decoder
DEG Degree
D-HOLE D-Shaped Hole
DIA
Diameter
DIP
Dual In-Line Package
DIP-SLDR Dip Solder
D-MODE
DO
DP
DP3T
DPDT
DWL
E-R
EXT
F
FC
Depletion Mode
Package Type
Designation
Deep, Depth, Dia-
metric Pitch, Dip
Double Pole Three
Throw
Double Pole Double
Throw
Dowel1
E
E-Ring
Extended, Extension,
External, Extinguish
F
Fahrenheit, Farad,
Female, Film
(Resistor), Fixed,
Flange, Frequency
Carbon Film/
Composition, Edge
of Cutoff Frequency,
Face
FDTHRU Feedthrough
FEM
Female
FIL-HD Fillister Head
FL
Flash, Flat, Fluid
FLAT-PT Flat Point
FR
Front
FREQ
Frequency
ABBREVIATIONS
FT Current Gain
Bandwidth Product
(Transition
Frequency), Feet,
Foot
FXD Fixed
G
GEN General, Generator
GND Ground
GP General Purpose,
Group
II
H Henry, High
HDW Hardware
HEX Hexadecimal,
Hexagon,
Hexagonal
HLCL Helical
HP
Hewlett-Packard
Company, High Pass
I
IC
Collector Current,
Integrated Circuit
ID Identification,
Inside Diameter
IF Forward Current,
Intermediate
Frequency
IN
Inch
1NCL Including
[NT
Integral, Intensity,
Internal
J
I-FET Junction Field
Effect Transistor
JFET Junction Field
Effect Transistor
K
K
Kelvin, Key,
Kilo, Potassium
KNRLD Knurled
KVDC Kilovolts
Direct Current
L
LED
LG
LIN
LK
LKG
LUM
Light Emitting
Diode
Length, Long
Linear, Linearity
Link, Lock
Leakage, Locking
Luminous
M
M Male, Maximum,
Mega, Mil, Milli,
Mode
MA
Milliampere
MACH Machined
MAX Maximum
MC
Molded Carbon
Composition
MET Metal, Metallized
MHZ
Megahertz
MINTR Miniature
MIT
Miter
MLD Mold, Molded
MM
Magnetized Material,
Millimeter
MOM
Momentary
MTG
Mounting
MTLC Metallic
MW
Milliwatt
4-4 Replaceable Parts