Mold-Masters Hot Runner

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5. Startup the system.

a) For empty systems or where there is no material in the gate detail,

extrude material through the Hot Runner system using 34.4 bar

(500 PSI) of back pressure.

The purpose is to ll the Visco-Seal at low pressure. This prevents

any possibility of leakage past the nozzle seal.

b) For systems lled with material, purge intended shot size twice from

the barrel prior to bringing the machine barrel forward to the Hot

Runner interface.

6. Set injection time and pressure according to part size, gate size and

material.

8.2.2 Stack Mold Systems

CAUTION

Failure to follow this procedure may result in leakage / damage occurring in

the Hot Runner.

CAUTION

IMPORTANT

When running thermally sensitive materials, use a thermally stable material

as recommended by the material supplier for the initial startup.

1. Heat up all Hot Runner manifolds, submanifolds, bridges, sub-bridges,

and inlets (excluding the nozzles) to processing temperature.

2. After manifolds, submanifolds, bridges and sub-bridges reach setpoint,

heat nozzles and spacers to 150°C (300°F).

3. Heat soak for 15 minutes.

4. Raise nozzle temperature to setpoint.

5. Heat soak for 20 minutes.

8.3 Shutdown

The correct shutdown procedure for your Hot Runner system depends on the

type of system:

• Standard systems: see “8.3.1 Standard Hot Runner Systems” on

page 8-4

• Stack mold systems: see ““8.3.2 Stack Mold System” on page 8-4

• Melt-Disk systems: see “18.9.1 Shutdown - Melt Link” on page 18-13

or “18.9.2 Shutdown - Reverse Melt Link ONLY” on page 18-14.

• Melt-CUBE systems: see “19.6.2 Shutdown” on page 19-34

Standard Hot Run Systems - continued

8-3SYSTEM STARTUP AND SHUTDOWN

Hot Runner User Manual

Mold-Masters Hot Runner - 8.3 Shutdown