RL78/G1H CHAPTER 31 ELECTRICAL SPECIFICATIONS
R01UH0575EJ0120 Rev. 1.20 Page 866 of 920
Dec 22, 2016
Note 1. Total current flowing into VDD, including the input leakage current flowing when the level of the input pin is fixed to VDD or
V
SS. The values below the MAX. column include the peripheral operation current. However, not including the current
flowing into the RF transceiver, A/D converter, LVD circuit, I/O port, and on-chip pull-up/pull-down resistors and the
current flowing during data flash rewrite.
Note 2. When high-speed on-chip oscillator and subsystem clock are stopped.
Note 3. When high-speed system clock and subsystem clock are stopped.
Note 4. When high-speed on-chip oscillator and high-speed system clock are stopped. When AMPHS1 = 1 (Ultra-low power
consumption oscillation). However, not including the current flowing into the RTC, 12-bit interval timer, and watchdog
timer.
Note 5. Relationship between operation voltage width, operation frequency of CPU and operation mode is as below.
HS (high-speed main) mode: 2.7 V ≤ V
DD ≤ 3.6 V@1 MHz to 32 MHz
2.4 V ≤ V
DD ≤ 3.6 V@1 MHz to 16 MHz
LS (low-speed main) mode: 1.8 V ≤ V
DD ≤ 3.6 V@1 MHz to 8 MHz
Remark 1. f
MX: High-speed system clock frequency (X1 clock oscillation frequency or external main system clock frequency)
Remark 2. f
IH: High-speed on-chip oscillator clock frequency (32 MHz max.)
Remark 3. f
SUB: Subsystem clock frequency (XT1 clock oscillation frequency)
Remark 4. Except subsystem clock operation, temperature condition of the TYP. value is T
A = 25°C
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