Agilent Technologies Nano Indenter G200 User Manual

B-1
Agilent Nano Indenter G200
User’s Guide
Agilent Technologies
B
Dynamic Contact Module II
Quick Start Guide B-2
Switching to the DCM II Head B-2
Switching to the XP Head B-6
NanoSuite Reference B-8
Commonly Used Procedures B-9
Changing the Tip B-9
Required Tools B-9
Procedure B-10
Testing the DCM II Performance B-15
The advantages of the Dynamic Contact Module II (DCM II) are:
• Improved resolution in both force and displacement.
• Decreased sensitivity to environmental noise.
These two advantages enable you to make meaningful measurements of
mechanical properties at displacements as small as 10
nm. The table
below shows the specifications for the DCM
II.
Indentation Head Assembly
Displacement Resolution 0.0002 nm
Range of Indenter Travel 70 mm
Loading Column Mass < 150 mg
Load Application Coil/Magnet Assembly
Displacement Measurement Capacitance Gauge
Typical Leaf Spring Stiffness _ 100 N/m
Typical Damping Coefficient 0.02 Ns/m
Typical Resonant Frequency 120 Hz
Loading Capability
Maximum Load 30 mN (3 gm)
Load Resolution 3 nN (0.3 mgm)

Agilent Technologies Nano Indenter G200 Specifications

General

Brand	Agilent Technologies
Model	Nano Indenter G200
Category	Laboratory Equipment
Language	English