AIXTRON - Dokumentation CONFIDENTIAL 191
8
crius_II_en_00, Edition 06/2010
System Manual Appendix
CRIUS II Glossary
sccm Standard cubic centimeters per minute. Gas flow in cm
3
/min at standard con-
ditions (20 °C, 1013 hPa).
SCS Safety control system. The SCS prevents any unsafe state of the system.
slm Standard liters per minute. Gas flow in l/min at standard conditions (20 °C,
1013 hPa).
Substrate Part which is coated during a process run.
TMC Transfer module controller. Controller for the transfer module.
Torr Pressure unit. This unit is obsolete and has been replaced by Pa.
1 Torr = 1.333 mbar = 133.3 Pa
UPS Uninterruptible power supply. Used to supply components with power during
a power failure. The UPS can supply power for a short time only.
Vacuum (in mbar) A region in which gas is present at a low pressure. Usually, we distinguish
between rough vacuum (10
3
…1 mbar), fine vacuum (1…10
-3
mbar), high
vacuum (10
-3
…10
-7
mbar), and ultrahigh vacuum (p < 10
-7
mbar).
Vacuum (in Pa) A region in which gas is present at a low pressure. Usually, we distinguish
between rough vacuum (10
5
…10
2
Pa), fine vacuum (10
2
…10
-1
Pa), high
vacuum (10
-1
…10
-5
Pa), and ultrahigh vacuum (p < 10
-5
Pa).
Valve A component which controls the flow or pressure of a gas. Typical examples:
Shut-off valve, metering valve, non-return valve, pressure relief valve.
Voltage sag A drop in the mains voltage for durations from half-cycle to a few seconds.
Also known as voltage dip.
Wafer A thin slice of semiconductor material which is used as a substrate in the fab-
rication of integrated circuits. In most cases, wafers consist of highly pure and
nearly defect free single crystalline silicon. Silicon wafers are available with
diameters of 25…300 mm and a thickness of 0.3…0.8 mm.
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