dsPIC30F Family Reference Manual
DS70072C-page 25-10 © 2004 Microchip Technology Inc.
25.3.8 OSEK Operating Systems
Operating Systems for the vehicle software standard OSEK/VDX will be developed for support
of the dsPIC30F product family. The functionality of OSEK, “Offene Systeme und deren
Schnittstellen für die Elektronik im Kraftfahrzeug” (Open systems and the corresponding
interfaces for automotive electronics), is harmonized with VDX “Vehicle Distributed eXecutive”
yielding OSEK/VDX.
Structured and modular RTOS software implementations based on standardized interfaces and
protocols will be provided. Structured and modular implementations will provide for portability and
extendability for distributed control units for vehicles.
Various OSEK COM modules will be provided, such as:
• OSEK/COM Standard API
• OSEK/COM Communication API
• OSEK/COM Network API
• OSEK/COM Standard Protocols
• OSEK/COM Device Driver Interface
Microchip will also provide Internal and External CAN driver support. The physical layer will be
integrated into the communication controller’s hardware and will not be covered by the OSEK
specifications.
Most module functions will be developed in ANSI C, with the exception of time critical functions
and peripheral utilization, which will be optimized in assembly, thereby reducing execution time
for maximum code efficiency. The Microchip MPLAB C30 C compiler will be supported.
25.3.9 TCP/IP Protocol Stack
Microchip will offer various Transmission Control Protocol/Internet Protocol (TCP/IP) Stack Layer
solutions for Internet connectivity solutions implemented on the dsPIC30F product family. Both
reduced and full stack implementations will be provided, which will allow the user to select the
optimum TCP/IP stack solution for their application.
Application protocol layers, such as FTP, TFTP and SMTP, Transport and Internet layers, such
as TCP, UDP, ICMP and IP, and Network Access layers, such as PPP, SLIP, ARP and DHCP, will
be provided. Various configurations, such as a minimal UDP/IP stack will be available for limited
connectivity requirements.
Most stack protocol functions will be developed and optimized in Microchip’s MPLAB C30 C
language. Assembly language coding may be developed for specific dsPIC30F hardware
peripherals and Ethernet drivers to optimize code size and execution time. These assembly
language specific routines will be assembly and C callable.
Electronic documentation will accompany the TCP/IP protocol stack, enabling the user to
efficiently understand and implement the protocol stack in their application.
Note: This product is currently under development at the time of this writing. Some of the
product details may change. Please refer to the Microchip web site or your local
Microchip sales office for the most current information and the availability of this
product.
Note: This product is currently under development at the time of this writing. Some of the
product details may change. Please refer to the Microchip web site or your local
Microchip sales office for the most current information and the availability of this
product.
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