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Avaya S8700 - Page 2315

Avaya S8700
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TDM-BUS (TDM Bus)
Issue 1 May 2002
8-1593555-233-143
If not:
a. Replace the circuit pack.
b. Turn the power back on to reboot the system.
4. Run test tdm P to determine whether the TDM-bus fault is still present.
5. If the TDM-bus fault is still present, the suspected circuit pack was not the
cause of the TDM-bus failure. Do the following:
a. Remove the replacement circuit pack that was just inserted and
replace it with the previously suspected circuit pack.
b. Repeat Procedure 3 for the next circuit pack on the list for this
procedure.
If none of the TDM-bus tests fail, the procedure is completed.
If Procedure 3 fails to identify the cause of the problem, go to ‘‘Procedure 4:
Isolating TDM-Bus Failures to Carriers’’.
Procedure for EPN with Duplicated PNC
In this type of configuration, the test procedure is made up of several independent
parts. In a duplicated system, it is desirable to investigate whether circuit packs
are causing TDM-bus problems when they are in active mode, in standby mode,
or both. The procedure utilizes a PNC interchange in an EPN. If the TDM-bus
fault disappears after an interchange takes place, the newly standby Expansion
Interface (EPN), is suspect and should be replaced. If the problem still exists, the
Tone-Clocks are then interchanged. If the TDM-bus failure then disappears, the
newly standby Tone-Clock is suspect and should be replaced. If the TDM-bus
problem still exists, then the procedure begins diagnostics on individual circuit
packs and backplane pins.
Part 1 (EPN Procedure)
1. Execute the status pnc command to determine which PNC is currently
active.
2. Run reset pnc interchange to make the currently active PNC standby.
3. Run test tdm P to determine whether the TDM-bus fault is still present.
If the TDM-bus fault is gone, replace the formerly active Expansion
Interface circuit pack.
4. Run reset pnc interchange again to activate the PNC where the new
Expansion Interface circuit pack resides.
5. Run test tdm P to determine whether the TDM-bus fault is still present.
If the TDM-bus fault is gone, the procedure is finished.
If not, replace the new Expansion Interface circuit pack with the originally
suspected circuit pack, and continue with Part 2.

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