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LPKF ProtoMat S62 - Page 47

LPKF ProtoMat S62
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For your notes
45 ProtoMat
®
S62
Tab. 4: Work steps in production phases
Production phase Work steps Processed material side
MarkingDrills Centre-punching bores
Drilling pass holes
Bottom
Read_Top Reading in pass holes
(only with VisionSystem)
Top
Read_Bottom Reading in pass holes
(only with VisionSystem)
Bottom
DrillingPlated Drilling holes for plating Bottom
DrillingUnplated Drilling mounting holes
(not for plating)
Top
MillingTop Milling Top
MillingBottom Milling Bottom
Info! Galvanic plating galvanic through-hole plating
(external with galvanic station)
All layers
Info! ProConduct Plating with the LPKF ProConduct
system
All layers
Info! MultiPress_work Pressing multiple layers with external
multi-layer press
All layers
Info! Apply foil to PCB Protective foil ProConduct Top and bottom
CuttingInside Milling internal cut-outs Top
CuttingOutside Milling contours Top
Read_Layer2
Read_Layer3
Read_Layer4
Reading in pass holes
(only with VisionSystem)
Top/bottom
Prepare_Top
Prepare_Bottom
Preparing outer layers for pressing,
drilling pass hole exemptions
(only with galvanically plated multi-lay-
ers)
Top/bottom

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