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Intel Xeon User Manual

Intel Xeon
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Layout Checklist
218 Design Guide
LAN Interface (Continued)
General
Guidelines
Vias to decoupling capacitors should be
sufficiently large in diameter.
To decrease series inductance.
Isolate I/O signals from high speed signals. To minimize crosstalk.
Avoid routing high-speed LAN or Phone line
traces near other high-frequency signals
associated with a video controller, cache
controller, processor, or other similar device.
To minimize crosstalk.
Place the 82562ET/EM part more than 1.5"
away from any board edge.
This minimizes the potential for
EMI radiation problems.
Place at least one bulk capacitor (4.7 µF or
greater OK) on each side of the 82562ET/
EM.
Research and development has
shown that this is a robust design
recommendation.
Place decoupling capacitors (0.1 µF) as
close to the 82562ET/EM as possible.
Power Decoupling
V_CPU_IO[2:0] Use one 0.1 µF decoupling capacitor. Locate
within 100 mils of the ICH3-S processor
interface balls.
Used to pull-up all processor I/F
signals.
VCC_3.3 Requires six 0.1 µF decoupling capacitors.
Distribute around the ICH3-S package sides
within 100 mils from the package balls:
– Top near AUX/PCI
– Left across the PCI and LPC
– Bottom near IDE.
VCCSUS_3.3 Requires two 0.1 µF decoupling capacitors.
Place one capacitor on the top side within
200 mils of the USB center. Place other on
bottom side near the VCCSus3_3 supply.
VCC_1.8 Requires four 0.1 µF decoupling capacitors.
Locate two capacitors distributed local to the
hub interface; within 50 mils of the package
hub interface balls. Distribute remaining
capacitors on the left and bottom sides of the
package for core delivery.
VCCSUS_1.8 Requires one 0.1 µF decoupling capacitor.
Locate within 200 mils of balls B23 and C23
of the
ICH3-S.
V5_REF_SUS Requires one 0.1 µF decoupling
capacitor.V5_REF_Sus affects only 5 V-
tolerance for USB OC[5:0]# balls, and can
be connected to VCCSus3_3 if 5 V tolerance
on these signal is not required.
V5_REF Requires one 0.1 µF decoupling capacitor.
V5REF is the reference voltage for 5V
tolerant inputs in the ICH3-S. Tie to balls
V5REF[2:1]. V5REF must power up before
or simultaneous to VCC3_3. It must power
down after or simultaneous to VCC3_3.
Table 14-3. Intel
®
ICH3-S Layout Checklist (Sheet 3 of 4)
Checklist Items Recommendations Comments

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Intel Xeon Specifications

General IconGeneral
BrandIntel
ModelXeon
CategoryProcessor
LanguageEnglish

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