STC micro STC8A8K64D4 Series - QFN64 Package Mechanical Data（8 Mm*8 Mm; Naming Rules of STC8 A8 K64 D4 Family

STC8A8K64D4 Series Manual
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4.5 QFN64 Package mechanical data（8mm*8mm）
D (8mm)
E (8mm)
PIN 1
A
A1
A3
1
16
17 32
48
33
64 49
K
b(0.20mm)
e(0.4mm)
L
E2
D2
R
1
16
17
33
51 64
32
47
R
K
L
e
E2
E
D2
D
b
A3
A2
A1
A
SYMBOL
0.09
0.30
5.90
7.90
5.90
7.90
0.15
0.50
0.00
0.70
MIN
- -
0.40 0.50
6.00 6.10
8.00 8.10
6.00 6.10
8.00 8.10
0.20 0.25
0.20REF
0.55 0.60
0.02 0.05
0.75 0.80
TYP MAX
General size
mm
0.40
0.500.30 0.40
The back metal sheet (substrate) of STC's existing DFN8 packaged chip is not grounded inside the chip. It can be grounded
or ungrounded on the user's PCB board, which will not affect the performance of the chip.
4.6 Naming rules of STC8A8K64D4 family