64 Rockwell Automation Publication 2198-UM002L-EN-P - October 2021
Chapter 2 Plan the Kinetix 5700 Drive System Installation
Electrical Noise Reduction This section outlines best practices that minimize the possibility of noise-
related failures as they apply specifically to Kinetix 5700 system installations.
For more information on the concept of high-frequency (HF) bonding, the
ground plane principle, and electrical noise reduction, refer to the System
Design for Control of Electrical Noise Reference Manual, publication
GMC-RM001
.
HF Bond for Modules
Bonding is the practice of connecting metal chassis, assemblies, frames,
shields, and enclosures to reduce the effects of electromagnetic interference
(EMI).
Unless specified, most paints are not conductive and act as insulators. To
achieve a good bond between the drive module and subpanel, surfaces need to
be paint-free or plated. Bonding metal surfaces creates a low-impedance
return path for high-frequency energy.
Improper bonding of metal surfaces blocks the direct return path and allows
high-frequency energy to travel elsewhere in the cabinet. Excessive high-
frequency energy can effect the operation of other microprocessor controlled
equipment.
IMPORTANT
To improve the bond between the drive module and subpanel, construct
your subpanel out of zinc plated (paint-free) steel.
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