TX120 S3 Upgrade and Maintenance Manual 257
Processors
11.2.6 Applying thermal paste
I For the Japanese market, the service engineer must follow the
instruction provided separately.
I If the processor upgrade or replacement kit contains a new CPU heat
sink, a thin layer of thermal compound has already been pre-applied to
its lower surface. In this case, please proceed with section "Installing the
processor heat sink" on page 259.
Figure 141: Thermal paste syringe
One thermal compound syringe (FTS-FSP:P304000004) contains thermal
paste for three processors.
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