11.6 Applying thermal paste
I – For the Japanese market, the service engineer must follow the
instruction provided separately.
– If the processor upgrade or replacement kit contains a new processor
heat sink, a thin layer of thermal compound has already been pre-
applied to its lower surface. In this case, please proceed with section
"Installing processor heat sinks" on page 288.
Figure 204: Thermal paste syringe
One thermal compound syringe (A3C40142460 / 34035576) contains thermal
paste for three processors.
Field Replaceable Unit
(FRU)
Hardware: 5 minutes
Tools: tool-less
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