HIWIN MIKROSYSTEM CORP. 2-1
2. Specifications
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2. Specifications ························································································································ 2-1
2.1 Drive information ··········································································································· 2-2
2.1.1 Safety certification ······························································································· 2-2
2.1.2 Nameplate information ························································································· 2-2
2.1.3 Model number ···································································································· 2-3
2.2 Drive specifications ········································································································ 2-4
2.3 Drive dimensions ··········································································································· 2-8
2.4 Drive installation ·········································································································· 2-20
2.5 Computer requirements ································································································· 2-21
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