NXP Semiconductors MC9S12G - Appendix D Package and die Information

Package and Die Information
MC9S12G Family Reference Manual Rev.1.27
NXP Semiconductors 1255
Appendix D
Package and Die Information
Revision History
Version
Number
Revision
Date
Description of Changes
Rev 0.01 2-Jan-2009 Initial release
Rev 0.02 25-Jan-2013 • Added D.7, “KGD Information”
Rev 0.03 31-Jan-2013 • Updated , “Bondpad Coordinates”