NXP Semiconductors MC9S12G - D.7 KGD Information

Package and Die Information
MC9S12G Family Reference Manual Rev.1.27
NXP Semiconductors 1273
D.7 KGD Information
Bondpad Coordinates
Table D-1. Bondpad Coordinates
Die Pad Bond Post
Die Pad
X Coordinate
Die Pad
Y Coordinate
Function
1 1 -1832.06 1347.5 PJ[6]
2 2 -1832.06 1223.5 PJ[5]
3 3 -1832.06 1116.5 PJ[4]
4 4 -1832.06 1009.5 PA[0]
5 5 -1832.06 902.5 PA[1]
6 6 -1832.06 795.5 PA[2]
7 7 -1832.06 688.5 PA[3]
8 8 -1832.06 603.5 RESET
9 9 -1832.06 496.5 VDDX1
10 10 -1832.06 369 VDDR
11 11 -1832.06 241.5 VSSX1
12 12 -1832.06 136.5 PE[0]
13 13 -1832.06 22.5 VSS1
14 14 -1832.06 -91.5 PE[1]
15 15 -1832.06 -201.5 TEST
16 16 -1832.06 -311.5 PA[4]
17 17 -1832.06 -396.5 PA[5]
18 18 -1832.06 -483.5 PA[6]
19 19 -1832.06 -578.5 PA[7]
20 20 -1832.06 -683.5 PJ[0]
21 21 -1832.06 -797.5 PJ[1]
22 22 -1832.06 -921.5 PJ[2]
23 23 -1832.06 -1054.5 PJ[3]
24 24 -1832.06 -1196.5 BKGD
25 25 -1832.06 -1347.5 PB[0]
26 26 -1707.5 -1472.06 PB[1]
27 27 -1506.5 -1472.06 PB[2]